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  toshiba original cmos 8-bit microcontroller tlcs-870/x series TMP88PU74FG semiconductor company
tmp88pu74 i 2008-03-06 document change notification ? ? the purpose of this notification is to inform customers about the launch of the pb-free version of the device. the introduction of a pb-f ree replacement affects the datash eet. please understand that this notification is intended as a temporary su bstitute for a revision of the datasheet. changes to the datasheet may include the following, though not all of them may apply to this particular device. ? 1. part number example: tmpxxxxxxf  tmpxxxxxxfg all references to the previous part number were left unchanged in body text. the new part number is indicated on the prelims pages (cover page and this notification). ? 2. package code and package dimensions example: lqfp100-p-1414-0.50c  lqfp100-p-1414-0.50f all references to the previous package code and package dimensions were left unchanged in body text. the new ones are indicated on the prelims pages. ? 3. addition of notes on lead solderability now that the device is pb-free, notes on lead solderability have been added. ? 4. restrictions on product use the previous (obsolete) provision might be left unchanged on page 1 of body text. a new replacement is included on the next page. ? 5. publication date of the datasheet the publication date at the lower right corner of the prelims pages applies to the new device.
tmp88pu74 ii 2008-03-06 1. part number 2. package code and dimensions previous part number (in body text) previous packa g e code (in body text) new part number new package code otp tmp88pu74f p-qfp80-1420-0.80b TMP88PU74FG qfp80-p-1420-0.80b ? * : for the dimensions of the new package, see the attached package dimensions diagram. 3. addition of notes on lead solderability the following solderability test is conducted on the new device. lead solderability of pb-free devices (with the g suffix) te st te s t c o n d i t i o n s r e m a r k solderability (1) use of lead (pb) solder bath temperature = 230c dipping time = 5 seconds the number of times = once use of r-type flux (2) use of lead (pb)-free solder bath temperature = 245c dipping time = 5 seconds the number of times = once use of r-type flux leads with over 95% solder coverage till lead forming are acceptable. 4. restrictions on product use the following replaces the ?restrictions on product use? on page 1 of body text. 5. publication date of the datasheet the publication date of this datasheet is printed at the lower right corner of this notification. restrictions on product use 20070701-en ? the information contained herein is subject to change without notice. ? toshiba is continually working to improve the quality and reliability of its products. nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. it is the responsibility of the buyer, when utilizing toshiba products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such toshiba products could cause loss of human life, bodily injury or damage to property. in developing your designs, please ensure that toshiba products are used within specified operating ranges as set forth in the most recent toshiba products specifications. also, please keep in mind the precautions and conditions set forth in the ?handling guide for semiconductor devices,? or ?toshiba semiconductor reliability handbook? etc. ? the toshiba products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.).these toshiba products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury (?unintended usage?). unintended usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. unintended usage of toshiba products listed in his document shall be made at the customer?s own risk. ? the products described in this document shall not be used or embedded to any downstream products of which manufacture, use and/or sale are prohibited under any applicable laws and regulations. ? the information contained herein is presented only as a guide for the applications of our products. no responsibility is assumed by toshiba for any infringements of patents or other rights of the third parties which may result from its use. no license is granted by implication or otherwise under any patents or other rights of toshiba or the third parties. ? please contact your sales representative for product-by-product details in this document regarding rohs compatibility. please use these products in this document in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances. toshiba assumes no liability for damage or losses occurring as a result of noncompliance with applicable laws and regulations. ? for a discussion of how the reliability of microcontrollers can be predicted, please refer to section 1.3 of the chapter entitled quality and reliability assurance/handling precautions.
tmp88pu74 iii 2008-03-06 (annex) package dimensions qfp80-p-1420-0.80b unit: mm ?

tmp88pu74 2003-02-17 88pu74-2 pin assignments (top view) p-qfp80-1420-0.80b p86 (v22) p85 (v21) p84 (v20) p83 (v19) p82 (v18) p81 (v17) p80 (v16) p77 (v15) p76 (v14) p75 (v13) p74 (v12) p73 (v11) p72 (v10) p71 (v9) p70 (v8) p67 (v7) p66 (v6) p65 (v5) p64 (v4) p63 (v3) p62 (v2) p61 (v1) p87 (v23) p60 (v0) ( v24 ) p90 ( v25 ) p91 ( v26 ) p92 (v27) p93 ( v28 ) p94 ( v29 ) p95 (v30) p96 ( v31 ) p97 ( v32 ) pd0 ( v33 ) pd1 (v34) pd2 ( v35 ) pd3 ( v36 ) pd4 vkk ( 1 sck ) p00 (si1) p01 (so1) p02 p03 p04 p05 p06 p07 vss xout xin reset (xtout) p22 (xtin) p21 test (stop/int5) p20 (int0) p10 (int1) p11 (tc2/ppg) p12 (dvo) p13 (pdo/pwm) p14 (tc1/int3) p15 (int2) p16 (int4/tc3) p17 (scl/si0) p30 (sda/so0) p31 vdd varef p53 (ain11) p52 ( ain10 ) p51 ( ain9 ) p50 ( ain8 ) p47 ( ain7 ) p46 ( ain6 ) p45 ( ain5 ) p44 ( ain4 ) p43 ( ain3 ) p41 ( ain1 ) p42 (ain2) p32 ( 0 sck ) vass 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 38 37 36 35 34 33 32 31 30 29 28 27 26 25 40 39 p40 ( ain0 ) 2007-11-02
tmp88pu74 2003-02-17 88pu74-3 pin function the tmp88pu74 has two modes: mcu and prom. (1) mcu mode in this mode, the tmp88pu74 is pin compatible with the tmp88cu74 (fix the test pi n at low level). (2) prom mode pin name (prom mode) input/ output functions pin name (mcu mode) a16 p60 a15 to a8 p05, p32 to 30, p53 to 50 a7 to a0 input prom address inputs p47 to p40 d7 to d0 i/o prom data input/outputs p17 to p10 ce chip enable signal input (active low) p03 oe output enable signal input (active low) p04 pgm input program mode single input p02 vpp  12.75 v/5 v (program supply voltage) test vcc 6.25 v/5 v vdd gnd power supply 0 v vss p37 to p30 p47 to p41 p54 to p50 pull-up with resistance for input processing p01 p21 prom mode setting pin. be fixed at high level. p07, p06, p00 p22, p20 reset input prom mode setting pin. be fixed at low level. p67 to p61 p77 to p70 p87 to p80 p97 to p90 pd4 to pd0 output open xin input xout output connect an 10 mhz oscillator to stabilize the internal state. varef vass 0 v (gnd) vkk power supply open 2007-11-02
tmp88pu74 2003-02-17 88pu74-4 operational description the configuration and functions of the tmp88pu74 are the same as those of the tmp88cu74, except in that a one-time prom is used instead of an on-chip mask rom. 1. operating mode the tmp88pu74 has two modes: mcu and prom. 1.1 mcu mode the mcu mode is activated by fixing the test/vpp pin at low level. in the mcu mode, operation is the same as with the tmp88cu74 (the test/vpp pin cannot be used open because it has no built-in pull-down resistance). 1.1.1 program memory the tmp88pu74 has a 96 kbytes (addresses 04000h to 1bfffh in the mcu mode, addresses 00000h to 17fffh in the prom mode) of program storage area and 256 byte (addresses fff00 to fffffh in the mcu mode, addresses 1ff00 to 1ffffh in the prom mode) one-time prom of vector table storage area. figure 1.1.1 program storage area vector table storage area 00000h 04000h 1bfffh fff00h fffffh tmp88pu74 mcu mode program storage area vector table storage area 00000h 04000h 1bfffh fff00h fffffh tmp88cu74 mcu mode program storage area note: either write the data ffh to the unused area vector table storage area 00000h 17fffh 1ff00h 1ffffh tmp88pu74 prom mode program storage area 2007-11-02
tmp88pu74 2003-02-17 88pu74-5 1.1.2 data memory the tmp88pu74 has an on-chip 2-kbyte data memory (static ram). 1.1.3 input/output circuitry (1) control pins the control pins of the tmp88pu74 are the same as those of the tmp88cu74 except that the test pin has is no built-in pull-down resistance. figure 1.1.2 test pin (2) i/o ports the i/o circuitries of tmp88pu74 i/o ports are the same as the i/o circuitries of the tmp88cu74. r note: test pin has no built-in pull-down resistance r 1 k : (typ.) 2007-11-02
tmp88pu74 2003-02-17 88pu74-6 1.2 prom mode the prom mode is activat ed by setting shown in figure 1.2.1. the prom mode is used to write and verify programs with a general-purpose prom programmer. the high-speed programming mode can be used for program operation. the tmp88pu74 is not supported an electric signature mode, so the rom type must be set to tc571000. set the adaptor socket switch to n. figure 1.2.1 setting for prom mode gnd v pp (12.75 v/5 v) v cc tmp88pu74 a16 to a0 d0 to d7 p60 p05 p32 to p30 p53 to p50 p47 to p40 xin vdd p01 p21 p03 p04 p02 p10 p17 test xout vss p20 p22 p00 p06 p07 oe pgm ce for more information on pins refer to the section on pin function. note: prom programmer connection adaptor socket: bm11131 reset to 2007-11-02
tmp88pu74 2003-02-17 88pu74-7 1.2.1 programming flowchart (high-speed programming) the high-speed programming mode is achiev ed by applying the program voltage (  12.75 v) to the vpp pin when vcc 6.25 v. after the address and input data are stable, the data is programmed by applying a single 0.1ms program pulse to the ce input. the programmed data is verified. if incorrect, another 0.1ms program pulse is applied and then the programmed data is verified. this process shoul d be repeated (up to 25 times) until the program operates correctly. after that, change the address and input data, and program as before. when programming has been completed, the data in all addresses should be verified with vcc vpp 5 v. figure 1.2.2 flowchart of high -speed programming yes yes ok ok error error no no no yes start v cc 6.25 v v pp 12.75 v n 0 single 0.1 ms program pulse data ff? v cc 5 v v pp 5 v pass error address = address + 1 n n  1 start address set last address? n t 25? verify read all address 2007-11-02
tmp88pu74 2003-02-17 88pu74-8 1.2.2 writing method for general-purpose prom program (1) adapters bm11131 (2) adapter setting switch (sw1) is set to side n. (3) prom programme r specifying i) prom type is specified to tc571000. writing voltage: 12.75 v (high-speed program) ii) data transfer (copy) (note 1) in tmp88pu74, eprom is within the addresses 00000h to 17fffh and the addresses 1ff00h to 1ffffh. data is required to be transferred (copied) to the addresses where it is possible to write. the program area in mcu mode and prom mode is referred to program memory area in figure 1.1.1. ex. in the block transfer (copy ) mode, executed as below. program area: transferred addresses 04000h to 1bfffh to addresses 00000 to 17fffh vector area: transferred addresses fff00h to fffffh to 1ff00 to 1ffffh iii) writing address is specified. (note 1) start address: 00000h end address: 1ffffh (4) writing writing/verifying is required to be executed in accordance with prom programmer operating procedure. note 1: the specifying method is referred to the prom programmer description. either write the data ffh to the unused area or set the prom programmer to access only the program storage area. note 2: when mcu is set to an adapter or the adapter is set to prom programmer, a position of pin 1 must be adjusted. if the setting is reversed, mcu, the adapter and prom program is damaged. note 3: the tmp88pu74 does not support the electric signature mode (hereinafter referred to as signature). if the signature is used in prom program, a device is damaged due to applying 12 v r 0.5 v to the address pin 9 (a9). the signature must not be used. 2007-11-02
tmp88pu74 2003-02-17 88pu74-9 electrical characteristics absolute maximum ratings (v ss 0 v) parameter symbol pins ratings unit supply voltage v dd 0.3 to 6.5 program voltage v pp test/vpp 0.3 to 13.0 input voltage v in 0.3 to v dd  0.3 v out1 p2, p3 (at open drain) 0.3 to v dd  0.3 output voltage v out2 p6, p7, p8, p9, pd v dd  40 to v dd  0.3 v i out1 p0, p1, p2, p4, p5 3.2 output current (per 1 pin) i out2 p6, p7, p8, p9, pd 25 6 i out1 p0, p1, p3, p4, p5 40 6 i out2 p0, p1, p2, p3, p4, p5 120 output current (total) 6 i out3 p6, p7, p8, p9, pd 160 ma power dissipation [topr 25c] pd (note 2) 1200 mw soldering temperature (time) tsld 260 (10 s) storage temperature tstg 55 to 125 operating temperature topr 30 to 70 c note 1: the absolute maximum ratings are rated values which must not be exceeded during operation, even for an instant. any one of the ratings must not be exceeded. if any absolute maximum rating is exceeded, a device may break down or its performance may be degraded, causing it to catch fire or explode resulting in injury to the user. thus, when designing products which include this device, ensure that no absolute maximum rating value will ever be exceeded. note 2: power dissipation (pd); for pd, it is necessary to decrease 14.3 mw/ q c. (refernce to tmp88cu74) recommended operatin g conditions (v ss 0 v, topr  30 to 70c) parameter symbol pins conditions min max unit normal1, 2 modes fc 12.5 mhz idle1, 2 modes 4.5 slow modes fs 32.768 khz sleep modes 2.7 supply voltage v dd stop modes 2.0 5.5 v ih1 except hysteresis input v dd u 0.70 v ih2 hysteresis input v dd t 4.5 v v dd u 0.75 input high voltage v ih3 v dd < 4.5 v v dd u 0.90 v dd v il1 except hysteresis input v dd u 0.30 v il2 hysteresis input v dd t 4.5 v v dd u 0.25 input low voltage v il3 v dd < 4.5 v 0 v dd u 0.10 v xin, xout v dd 4.5 to 5.5 v (note 2) 8 12.5 mhz clock frequency fc xtin, xtout v dd 2.7 to 5.5 v 30.0 34.0 khz note 1: the recommended operating conditions for a device are operating conditions under which it can be guaranteed that the device will operate as specified. if the device is used under operating conditions other than the recommended operatin g conditions (supply voltage, operating temperature range, specified ac/dc values etc.), malfunction may occur. thus, when designing products which include this device, ensure that the recommended operating conditions for the device are always adhered to. note 2: clock frequency fc: supply voltage range is specified in normal 1/2 mode and idle 1/2 mode. 2007-11-02
tmp88pu74 2003-02-17 88pu74-10 dc characteristics (v ss 0 v, topr  30 to 70 q c) parameter symbol pins conditions min typ. max unit hysteresis voltage v hs hysteresis input  0.9  v i in1 test i in2 open drain ports, tri-state ports input current i in3 reset , stop v dd 5.5 v v in 5.5 v/0 v  r2 p a input resistance r in3 reset 100 220 450 pull-down resistance r k source open drain ports v dd 5.5 v, v kk  30 v 50 80 110 k : i lo1 sink open drain ports v dd 5.5 v, v out 5.5 v  2 i lo2 source open drain ports v dd 5.5 v, v out  32 v  2 output leakage current i lo3 tri-state ports v dd 5.5 v, v out 5.5 v/ 0v  2 p a output high voltage v oh tri-state ports v dd 4.5 v, l oh  0.7 ma 4.1  output low voltage v ol except xout v dd 4.5 v, i ol 1.6 ma  0.4 v output high current i oh p6, p7, p8, p9, pd port v dd 4.5 v, v oh 2.4 v  20  supply current in normal 1, 2 modes  13.5 20 supply current in idle 1, 2 modes v dd 5.5 v v in 5.3 v/0.2 v fc 12.5 mhz fs 32.768 khz  5.5 8.5 ma supply current in slow mode  30 60 supply current in sleep mode v dd 3.0 v v in 2.8 v/0.2 v fs 32.768 khz  15 30 supply current in stop mode i dd v dd 5.5 v v in 5.3 v/0.2 v  0.5 10 p a note 1: typical values show those at topr 25 q c, vdd 5 v. note 2: input current iin3; the current through resistor is not included, when the input resistor (pull-up/pull-down) is contained. ad conversion characteristics (v ss 0 v, v dd 4.5 to 5.5 v, topr  30 to 70 q c) parameter symbol conditions min typ. max unit v aref 4.5  v dd analog reference voltage v ass v ss analog reference voltage range v ain v ass  v aref v analog input voltage i ref v aref 5.5 v, v ass 0.0 v  0.5 1.0 ma nonlinearity error  r1 zero point error  r1 full scale error  r1 total error v dd 5.0 v, v ss 0.0 v v aref 5.000 v v ass 0.000 v  r2 lsb note: quantizing error is not contained in those errors. 2007-11-02
tmp88pu74 2003-02-17 88pu74-11 ac characteristics (v ss 0 v, v dd 4.5 to 5.5 v, topr  30 to 70 q c) parameter symbol conditions min typ. max unit in normal1, 2 modes in idle1, 2 modes 0.32  0.5 in slow mode machine cycle time tcy in sleep mode 117.6  133.3 p s high level clock pulse width t wch low level clock pulse width t wcl for external clock operation (xin input), fc 12.5 mhz 33.75  ns high level clock pulse width t wsh low level clock pulse width t wsl for external clock operation (xtin input), fs 32.768 khz 14.7  p s recommended oscillating conditions (v ss 0 v, v dd 4.5 to 5.5 v, topr  30 to 70 q c) recommended constant parameter oscillator oscillation frequency recommended oscillator c 1 c 2 12.5 mhz murata csa12.5mtz 30 pf 30 pf ceramic resonator 8 mhz murata csa8.00mtz 30 pf 30 pf high-frequency oscillation crystal oscillator 12.5 mhz ndk at-51 10 pf 10 pf low-frequency oscillation crystal oscillator 32.768 khz ndk mx-38t 15 pf 15 pf note 1: an electrical shield by metal shied plate on the ic package should be recommend able in order to prevent the device from the high electric fieldstress applied for continuous reliable operation. note 2: the product numbers and specifications of the resonators by murata manufacturing co., lt d. are subject to change. for up-to-date information, please refer to the following url; http://www.murata.co.jp/search/index.html xin xout c 2 (1) high-frequency oscillation c 1 xtin xtout (2) low-frequency oscillation c 2 c 1 2007-11-02
tmp88pu74 2003-02-17 88pu74-12 dc/ac characteristics (prom mode) (v ss 0 v) (1) read operation (vdd 5.0 r 0.25 v, topr 25 r 5 q c) parameter symbol conditions min typ. max unit input high voltage (a0 to a16, ce , oe , pgm ) v ih4 v dd u 0.7  v dd input low voltage (a0 to a16, ce , oe , pgm ) v il4 0  0.8 program power supply voltage v pp 4.75 5.0 5.25 v address access time t acc  1.5tcyc  300  ns note: tcyc 400 ns at 10 mhz high-z t acc d7 to d0 data outputs a 16 to a0 ce oe pgm 2007-11-02
tmp88pu74 2003-02-17 88pu74-13 (2) high-speed programming operation (topr 25 r 5 q c, vdd 6.25 r 0.25 v) parameter symbol conditions min typ. max unit input high voltage (d0 to d7, a0 to a16 ce , oe , pgm ) v ih4 v dd u 0.7  v dd input low voltage (d0 to d7, a0 to a16, ce , oe , pgm ) v il4 0  0.8 program power supply voltage v pp 12.5 12.75 13.0 v initial program pulse width t pw v dd 6.0 v 0.095 0.1 0.105 ms note 1: when v cc power supply is turned on or after, v pp must be increased. when v cc power supply is turned off or before, v pp must be decreased. note 2: the device must not be set to the eprom programmer or picked up from it under applying the program voltage (12.75 v r 0.5 v) to the v pp pin as the device is damaged. note 3: be sure to execute the recommended programing mode with the recommended programing adaptor. if a mode or an adaptor except the above, the misoperation sometimes occurs. high-program input data a 16 to a0 ce oe unknown d7 to d0 output data t pw pgm v pp verify write 2007-11-02
tmp88pu74 2003-02-17 88pu74-14 2007-11-02


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